Not long ago, it was reported that SwaySure, a key semiconductor development company in China, which is 100% owned by Shenzhen International Trade Co., Ltd., recruited Liu Xiaoqiang, the former director of TSMC Nanke’s 18th factory, as the CEO. Now, there are rumors that TSMC will leave. Market sources point out that Suk Lee, who is in charge of TSMC’s Open Innovation Platform (OIP), has officially joined Intel’s camp after leaving TSMC not long ago. After joining Intel, Suk Lee’s title is Ecosystem Development VP.
It is understood that Suk Lee, a South Korean national, has worked at TSMC for many years. Currently, he can still search for videos of Suk Lee in an exclusive interview with foreign media many years ago on YouTube. He worked in TSMC’s US branch in the early days and then returned to TSMC’s Hsinchu headquarters. The open innovation platform business is the main work he has been responsible for.
According to TSMC’s description on the official website, the open innovation platform is a complete design technology framework, covering all key integrated circuit design categories, effectively reducing various obstacles that may be encountered during design, and improving the chance of success in the first production. . The open innovation platform combines the semiconductor design industry, TSMC’s design ecosystem partners, TSMC’s silicon intellectual property (IP), design applications, design for manufacturability services, process technology, and back-end packaging and testing services to bring the most timely innovation. It can be seen that the importance of the open innovation platform for both TSMC and customers.
▲ Suk Lee was interviewed by foreign media many years ago.
In fact, just before Suk Lee was rumored to join the Intel team and serve as vice president of ecosystem development business, Intel’s foundry service (IFS) also announced a few days ago that it will establish the IFS Cloud Alliance (IFS Cloud Alliance) , realizes a secure design environment in the cloud, and improves the design efficiency of foundry customers by utilizing massive on-demand computing, while accelerating time to market. Initial members include Amazon Web Services and Microsoft Azure, as well as major electronic design automation (EDA) players.
Intel emphasized that through this cloud alliance, IFS is expected to work with partners to ensure that EDA tools are optimized for cloud scalability benefits while meeting Intel’s Process Design Kit (PDK) requirements. By partnering with leading EDA vendors such as Ansys, Cadence, Siemens EDA and Synopsys, provide customers with a secure and scalable path to using the EDA tools and processes of their choice in cloud environments. The result is a foundry platform that provides on-demand hardware, allowing designers to accommodate larger workloads with better resource management, time-to-market and quality of results.
It can be seen from the above statement of Intel that Intel, which has returned to the foundry market, is to follow the example of TSMC’s open innovation platform architecture to establish a complete foundry ecosystem, and to further develop its future with TSMC. further competition. Now, if the senior management of TSMC who was originally responsible for the open innovation platform is poached, how much benefit will be produced in the future, and what kind of impact it will have on TSMC remains to be seen in the future.
(Source of the first image: Screenshot of the video)
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