[Financial News/Reporter Li Chunjun]Details of Intel’s new-generation Lunar Lake-MX processor, which is expected to be launched in the second half of next year, were revealed by netizens and attracted global market attention. The most noteworthy thing is that Lunar Lake’s CPU and The computing chip integrated into the GPU will directly use TSMC’s (2330) 3-nanometer N3B process. Lunar Lake-MX processors are Intel’s low-power product line expected to be launched in 2024 and are expected to replace the Meteor Lake-U series processors that have not yet been launched. However, according to the latest technical details disclosed by netizens, the architecture of this series of processors will undergo major changes, including the integrated computing core of the CPU and GPU, which will be produced using TSMC’s 3nm N3B process. There are even rumors in the industry that Intel will start wafer production in the middle of next year. This move will undoubtedly announce in advance that TSMC’s 3nm capacity utilization rate will be able to maintain full capacity next year.
According to disclosed information, the CPU cores of Intel’s Lunar Lake-MX processor include Lion Cove and Skymont. The GPU core is the second-generation Xe2-LPG core code-named Battlemage, which will be integrated into the same computing chip block design and utilize Intel’s Foveros advanced packaging integrates I/O chip blocks into a single logic chip.
At the same time, Intel Lunar Lake-MX will also adopt the design of Apple’s M2 and M3 processors, integrating DRAM and Lunar Lake-MX’s single logic chip into the same chip using advanced packaging technology.